pin grid array socket

pin grid array socket
панель для ІС в корпусі з матричними виводами

English-Ukrainian dictionary of microelectronics. 2013.

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  • Pin grid array — A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging. In a PGA, the pins are arranged in a square array that may or may not cover the bottom of the package. The pins are commonly spaced… …   Wikipedia

  • Flip-chip pin grid array — (FC PGA or FCPGA) is a form of pin grid array processor architecture package in which the die faces downwards on the top of the CPU with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other… …   Wikipedia

  • Ceramic pin grid array — 133 MHz Pentium chip in a ceramic package You may be looking for Cornish Pilot Gig Association. CPGA stands for Ceramic Pin Grid Array, a type of packaging used by integrated circuits. This type of packaging uses a ceramic substrate with… …   Wikipedia

  • Organic pin grid array — An OPGA CPU. Note the brown colour many OPGA parts are coloured green. The die is in the centre of the device, and the four grey circles are foam spacers to relieve pressure caused by the heat sink from the die. The Organic Pin Grid Array (OPGA)… …   Wikipedia

  • Flip-chip pin grid array — Un socket flip chip pin grid array, ou FCPGA, permet de connecter un microprocesseur sur une carte mère. Le format FCPGA est une variation du format PGA, pin grid array, dans lequel la puce est retournée (flip chip), permettant une meilleure… …   Wikipédia en Français

  • Flip-Chip Pin Grid Array — Eine 100 MHz Pentium CPU auf einem CPGA (IC auf der Unterseite) …   Deutsch Wikipedia

  • Land grid array — Socket 775 on a motherboard. The land grid array (LGA) is a type of surface mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket rather than the integrated circuit. An LGA can be electrically connected… …   Wikipedia

  • Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents …   Wikipedia

  • Land grid array — Contenido 1 Concepto 2 Características 3 LGA en PC s personales y servidores 4 Lista de sockets para CPU s LGA …   Wikipedia Español

  • Socket 370 — Especificaciones Tipo PGA ZIF Factor de forma del chip …   Wikipedia Español

  • Socket 604 — Type PGA ZIF Chip form factors pin grid array Contacts 604 Processors Intel Xeon …   Wikipedia


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